Based on the theory of reliability enhancement testing technology, this study used a variety of testing combinations and finite element simulations to analyze the stress-strain properties of 3D packaging storage modules and then evaluated its operating and destruction limits during temperature cycling tests (-65 °C~+150 °C) for the purpose of identifying the weak points and failure mechanisms affecting its reliability. As a result of temperature cycling ultimate stress, 3D packaging storage devices can suffer from thermal fatigue failure in the case of abrupt temperature changes. The cracks caused by the accumulation of plastic and creep strains can be considered the main factors. Crack formation is accelerated by the CTE difference between the epoxy resin and solder joints. Moreover, the finite element simulation results were essentially the same as the testing results, with a deviation occurring within 10%.
Keywords: 3D packaging; reliability enhancement test; temperature cycling; ultimate stress.