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Symmetric miniaturized heating system for active microelectronic devices.
Rev Sci Instrum. 2010 Jul;81(7):075112. doi: 10.1063/1.3469794.
Rev Sci Instrum. 2010.
PMID: 20687764
Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding.
Huang Y, Shah A, Mayer M, Zhou NY, Persic J.
Huang Y, et al. Among authors: persic j.
IEEE Trans Ultrason Ferroelectr Freq Control. 2010 Jan;57(1):241-52. doi: 10.1109/TUFFC.2010.1402.
IEEE Trans Ultrason Ferroelectr Freq Control. 2010.
PMID: 20040450
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Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire.
Cao J, Zhang J, Persic J, Song K.
Cao J, et al. Among authors: persic j.
Micromachines (Basel). 2020 Aug 14;11(8):777. doi: 10.3390/mi11080777.
Micromachines (Basel). 2020.
PMID: 32824089
Free PMC article.
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Characterization of thermochemical properties of Al nanoparticle and NiO nanowire composites.
Wen JZ, Ringuette S, Bohlouli-Zanjani G, Hu A, Nguyen NH, Persic J, Petre CF, Zhou YN.
Wen JZ, et al. Among authors: persic j.
Nanoscale Res Lett. 2013 Apr 20;8(1):184. doi: 10.1186/1556-276X-8-184.
Nanoscale Res Lett. 2013.
PMID: 23601907
Free PMC article.
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A Review of Silver Wire Bonding Techniques.
An B, Zhou H, Cao J, Ming P, Persic J, Yao J, Chang A.
An B, et al. Among authors: persic j.
Micromachines (Basel). 2023 Nov 20;14(11):2129. doi: 10.3390/mi14112129.
Micromachines (Basel). 2023.
PMID: 38004986
Free PMC article.
Review.
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