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Via Method for Lithography Free Contact and Preservation of 2D Materials.
Telford EJ, Benyamini A, Rhodes D, Wang D, Jung Y, Zangiabadi A, Watanabe K, Taniguchi T, Jia S, Barmak K, Pasupathy AN, Dean CR, Hone J. Telford EJ, et al. Among authors: jung y. Nano Lett. 2018 Feb 14;18(2):1416-1420. doi: 10.1021/acs.nanolett.7b05161. Epub 2018 Feb 5. Nano Lett. 2018. PMID: 29385346
Enhanced Superconductivity in Monolayer Td-MoTe2.
Rhodes DA, Jindal A, Yuan NFQ, Jung Y, Antony A, Wang H, Kim B, Chiu YC, Taniguchi T, Watanabe K, Barmak K, Balicas L, Dean CR, Qian X, Fu L, Pasupathy AN, Hone J. Rhodes DA, et al. Among authors: jung y. Nano Lett. 2021 Mar 24;21(6):2505-2511. doi: 10.1021/acs.nanolett.0c04935. Epub 2021 Mar 9. Nano Lett. 2021. PMID: 33689385
Damage-Free Atomic Layer Etch of WSe2: A Platform for Fabricating Clean Two-Dimensional Devices.
Nipane A, Choi MS, Sebastian PJ, Yao K, Borah A, Deshmukh P, Jung Y, Kim B, Rajendran A, Kwock KWC, Zangiabadi A, Menon VM, Schuck PJ, Yoo WJ, Hone J, Teherani JT. Nipane A, et al. Among authors: jung y. ACS Appl Mater Interfaces. 2021 Jan 13;13(1):1930-1942. doi: 10.1021/acsami.0c18390. Epub 2020 Dec 22. ACS Appl Mater Interfaces. 2021. PMID: 33351577
8,375 results