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Liu J, Ding Y, Wang F, Ran J, Zhang H, Xie H, Pi Y, Ma L.Liu J, et al. Among authors: pi y.J Colloid Interface Sci. 2024 Aug 15;668:213-222. doi: 10.1016/j.jcis.2024.04.154. Epub 2024 Apr 23.J Colloid Interface Sci. 2024.PMID: 38677210
Pi Y, Luo G, Wang P, Xu W, Yu J, Zhang X, Fu Z, Yang X, Wang L, Ding Y, Wang F.Pi Y, et al.Materials (Basel). 2022 May 20;15(10):3668. doi: 10.3390/ma15103668.Materials (Basel). 2022.PMID: 35629697Free PMC article.
Qiao F, Wang J, Yu R, Pi Y, Huang M, Cui L, Liu Z, An Q.Qiao F, et al. Among authors: pi y.Small Methods. 2024 Jan;8(1):e2300865. doi: 10.1002/smtd.202300865. Epub 2023 Oct 6.Small Methods. 2024.PMID: 37800984
Pi Y , Gan Z , Li Z , Ruan Y , Pei C , Yu H , Han K , Ge Y , An Q , Mai L .Pi Y , et al.Nanoscale. 2020 Nov 7;12(41):21165-21171. doi: 10.1039/d0nr04884d. Epub 2020 Oct 15.Nanoscale. 2020.PMID: 33057560
Tang H, Chao F, Luo H, Yu K, Wang J, Chen H, Jia R, Xiong F, Pi Y, Luo P, An Q.Tang H, et al. Among authors: pi y.ChemSusChem. 2023 Aug 7;16(15):e202300403. doi: 10.1002/cssc.202300403. Epub 2023 Jun 22.ChemSusChem. 2023.PMID: 37078693
Pi Y, Gan Z, Yan M, Li Z, Ruan Y, Pei C, Yu H, Ge Y, An Q, Mai L.Pi Y, et al.ACS Appl Mater Interfaces. 2021 Feb 24;13(7):8219-8228. doi: 10.1021/acsami.0c18993. Epub 2021 Feb 9.ACS Appl Mater Interfaces. 2021.PMID: 33560816
Han C, Pi Y, An Q, Mai L, Xie J, Xu X, Xu L, Zhao Y, Niu C, Khan AM, He X.Han C, et al. Among authors: pi y.Nano Lett. 2012 Sep 12;12(9):4668-73. doi: 10.1021/nl301993v. Epub 2012 Aug 3.Nano Lett. 2012.PMID: 22862740
Luo Y, Xu X, Zhang Y, Pi Y, Yan M, Wei Q, Tian X, Mai L.Luo Y, et al. Among authors: pi y.ACS Appl Mater Interfaces. 2015 Aug 12;7(31):17527-34. doi: 10.1021/acsami.5b05451. Epub 2015 Aug 3.ACS Appl Mater Interfaces. 2015.PMID: 26196544
Mai L, Xu L, Gao Q, Han C, Hu B, Pi Y.Mai L, et al. Among authors: pi y.Nano Lett. 2010 Jul 14;10(7):2604-8. doi: 10.1021/nl1013184.Nano Lett. 2010.PMID: 20503986
Du S, Cai Z, Wu Z, Pi Y, Wang S.Du S, et al. Among authors: pi y.IEEE Trans Image Process. 2024 May 24;PP. doi: 10.1109/TIP.2024.3403055. Online ahead of print.IEEE Trans Image Process. 2024.PMID: 38787665